Intel Leaks Specs for 900-Series Chipsets, Drops CPU Unlock Fees
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Intel leaked specifications for its next-generation 900-series chipsets on Feb. 9, revealing plans for the Z990, Z970, W980, Q970, and B960 models. The chipsets will support upcoming Nova Lake-S desktop CPUs and eliminate fees for CPU overclocking, according to a report from VideoCardz.
Quick Summary
- •Intel leaked specifications for its next-generation 900-series chipsets on Feb. 9, revealing plans for the Z990, Z970, W980, Q970, and B960 models. The chipsets will support upcoming Nova Lake-S desktop CPUs and eliminate fees for CPU overclocking, according to a report from VideoCardz.
- •Key company: Intel
Intel leaked specifications for its next-generation 900-series chipsets on February 9, 2026, according to a report from VideoCardz cited by WCCFtech. The leak detailed five new models: the Z990, Z970, W980, Q970, and B960. These chipsets are designed to support the company's upcoming Nova Lake-S desktop processors.
In a separate development also reported on February 9, TugaTech stated that Intel will cease charging fees to unlock overclocking functions on its processors. This move eliminates a previous monetization strategy that applied to certain non-K series CPUs, allowing for greater user customization without an additional cost. The report did not specify if this policy change would be implemented immediately or coincide with the launch of the new hardware.
The 900-series chipset leak suggests a tiered product stack. The Z990 is positioned as the flagship model for enthusiasts, while the Z970 is also targeted at high-performance users. The W980 is indicated for workstation applications, with the Q970 and B960 aimed at business and mainstream desktop segments, respectively. These specifications were published by WCCFtech, which attributed the original information to VideoCardz.
In a related but distinct corporate development, Intel is pursuing growth in its contract manufacturing division. CNBC reported that Intel Foundry Services has secured an agreement to manufacture semiconductors for Taiwan's MediaTek. The chips are intended for a range of smart edge devices, marking a significant partnership for Intel as it attempts to compete with Asian manufacturing rivals like TSMC.
Further connecting Intel and MediaTek, a separate rumor was reported by WCCFtech on February 9. The outlet described a "wild rumor" suggesting Intel could be partnering with MediaTek to utilize its Dimensity chips for Intel's own 14A process technology. This report was explicitly labeled as speculative and lacked confirmation from either company.
In unrelated financial news, investment firm Apollo Global Management has offered to make a multibillion-dollar investment in Intel. The Verge, citing a Bloomberg report, stated that Apollo proposed an "equity-like investment" of up to $5 billion. This follows other rumors of potential investment or acquisition interest, including from Qualcomm, as the chipmaker seeks capital for its extensive turnaround and fabrication expansion plans.
The decision to remove CPU unlock fees represents a shift in Intel's strategy for engaging with PC enthusiasts and builders. This change could make its platforms more attractive compared to competitors by offering a wider range of overclockable processors without hidden costs, potentially improving its value proposition in a competitive market.
The expansion of Intel's foundry business with the MediaTek deal is a core component of CEO Pat Gelsinger's IDM 2.0 strategy to revitalize the company. As reported by CNBC, winning a client of MediaTek's stature provides a tangible boost to Intel Foundry Services' credibility and its goal of becoming a major contract chip manufacturer for the global industry.
These developments occur amid broader industry shifts, including speculation about Apple's modem supply chain. A discussion on the Ars Technica OpenForum noted that Apple is reportedly looking at Intel and MediaTek as potential suppliers for modem silicon, which could represent another significant opportunity for both companies if Qualcomm's relationship with Apple changes.
The potential investment from Apollo, as covered by The Verge, highlights the significant financial requirements of Intel's ambitious plans to build new fabrication plants and develop advanced process nodes. Such a large capital infusion could provide necessary resources without necessitating a full acquisition of the company.
Intel's simultaneous efforts to launch new consumer products, expand its foundry operations, and secure major financing illustrate the multifaceted approach the company is taking under its current leadership. Each initiative addresses a different challenge, from product competitiveness and manufacturing scale to corporate financial stability.